A structure that will integrate 6 to 8 blocks for the production of chips, with 10,000 employees and 100,000 people involved with the related industries. In fact, Intel will build a small town dedicated to silicon
Intel’s development plans for the next few years are strongly linked to the IDM 2.0 strategy, a name that identifies Intel’s project linked to the production of semiconductors on behalf of customers. The company’s goal for the next few years is to sustain growth not only by producing its own solutions but also by dedicating itself to building chips developed by other companies. Hence the desire to build a new campus which, in terms of size and number of people involved in the production, directly and indirectly, will take on the size and scope of a small town. On campus there will be space from 6 to 8 units dedicated to the production and packaging of the chips, using the proprietary technologies that the company has announced over the past few weeks. Each module dedicated to the production of chips is expected to cost between 10 and 15 billion US dollars, a figure that could lead to an overall cost of the entire structure in excess of 100 million dollars.
In the 10 years since the start of construction, this new campus will see the employment of approximately 10,000 employees, with a total of 100,000 new jobs created through the related industries. Given the size and the number of people involved, it is easy to imagine that Intel could build the new campus near a big city, also taking advantage of the university structure to find new qualified personnel to hire. Pat Gelsinger anticipated that by the end of the year it will be indicated where in the United States this new production complex will be built. The production should take place in the course of 2024, so it will take a few more years for this initiative to see the light. This development move by Intel confirms how strongly the company is interested in expanding its business by increasingly turning to customers who will delegate the production of their solutions to it. What was anticipated by the company during the Intel Accelerated event of the past weeks leaves no room for doubt: a strategy made up of increasingly sophisticated production processes, flanked by technologies for packaging and interconnections that will allow the production of chips that at the moment they do not exist and will be the future of technological development in the coming years.